- 您现在的位置：买卖IC网 > Sheet目录505 > RXM-869-ES_ (Linx Technologies Inc)RECEIVER RF 869MHZ 16PIN SMD
BOARD LAYOUT GUIDELINES
If you are at all familiar with RF devices, you may be concerned about
specialized board layout requirements. Fortunately, because of the care taken by
Linx in designing the modules, integrating them is very straightforward. Despite
this ease of application, it is still necessary to maintain respect for the RF stage
and exercise appropriate care in layout and application in order to maximize
performance and ensure reliable operation. The antenna can also be influenced
by layout choices. Please review this data guide in its entirety prior to beginning
your design. By adhering to good layout principles and observing some basic
design rules, you will be on the path to RF success.
The adjacent figure shows the suggested
PCB footprint for the module. The actual pad
dimensions are shown in the Pad Layout
section of this manual. A ground plane (as
large as possible) should be placed on a
lower layer of your PC board opposite the
module. This ground plane can also be critical
to the performance of your antenna, which will
be discussed later. There should not be any
ground or traces under the module on the
same layer as the module, just bare PCB.
GROUND PLANE
ON LOWER LAYER
SHORT MICROSTRIP TRACE
Figure 12: Suggested PCB Layout
During prototyping, the module should be soldered to a properly laid-out circuit
board. The use of prototyping or “perf” boards will result in horrible performance
and is strongly discouraged.
No conductive items should be placed within 0.15in of the module’s top or sides.
Do not route PCB traces directly under the module. The underside of the module
has numerous signal-bearing traces and vias that could short or couple to traces
on the product’s circuit board.
The module’s ground lines should each have their own via to the ground plane
and be as short as possible.
AM / OOK receivers are particularly subject to noise. The module should, as
much as reasonably possible, be isolated from other components on your PCB,
especially high-frequency circuitry such as crystal oscillators, switching power
supplies, and high-speed bus lines. Make sure internal wiring is routed away
from the module and antenna, and is secured to prevent displacement.
The power supply filter should be placed close to the module’s V CC line.
In some instances, a designer may wish to encapsulate or “pot” the product.
Many Linx customers have done this successfully; however, there are a wide
variety of potting compounds with varying dielectric properties. Since such
compounds can considerably impact RF performance, it is the responsibility of
the designer to carefully evaluate and qualify the impact and suitability of such
materials.
The trace from the module to the antenna should be kept as short as possible.
A simple trace is suitable for runs up to 1/8-inch for antennas with wide
bandwidth characteristics. For longer runs or to avoid detuning narrow bandwidth
antennas, such as a helical, use a 50-ohm coax or 50-ohm microstrip
transmission line as described in the following section.
Page 10
发布紧急采购，3分钟左右您将得到回复。
相关PDF资料
RXM-GPS-SG-T
GPS MODULE SMD SIRF
RXM-GPS-SR-T
GPS MODULE SMD SIRF W/ANT
RZE002P02TL
MOSFET P-CH 20V 200MA EMT3
RZF020P01TL
MOSFET P-CH 12V 2A TUMT3
RZF030P01TL
MOSFET P-CH 12V 3A TUMT3
RZM002P02T2L
MOSFET P-CH 20V 0.2A UMT6
RZQ045P01TR
MOSFET P-CH 12V 4.5A TSMT6
RZQ050P01TR
MOSFET P-CH 12V 5A TSMT6
相关代理商/技术参数
RXM-900-HP3
制造商:未知厂家 制造商全称:未知厂家 功能描述:HP3 SERIES RECEIVER MODULE DATA
RXM-900-HP3-PPO
功能描述:射频模块 RF Receiver 900MHz 8-CH SIP Pack
RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm
RXM-900-HP3-PPO_
功能描述:RECEIVER RF 900MHZ 8-CHANNEL RoHS:是 类别:RF/IF 和 RFID >> RF 接收器 系列:HP3 产品培训模块:Lead (SnPb) Finish for COTS 产品变化通告:Product Discontinuation 09/Jan/2012 标准包装:50 系列:* 频率:850MHz ~ 2.175GHz 灵敏度:- 数据传输率 - 最大:- 调制或协议:- 应用:* 电流 - 接收:* 数据接口:PCB，表面贴装 存储容量:- 天线连接器:PCB，表面贴装 特点:- 电源电压:4.75 V ~ 5.25 V 工作温度:0°C ~ 85°C 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP（6x6） 包装:托盘
RXM-900-HP3-PPS
功能描述:射频模块 RF Receiver 900MHz 8 & 100-CH SIP Pack RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm
RXM-900-HP3-PPS_
功能描述:RECEIVER RF 900MHZ 8PAR/120SRLCH RoHS:是 类别:RF/IF 和 RFID >> RF 接收器 系列:HP3 产品培训模块:Lead (SnPb) Finish for COTS 产品变化通告:Product Discontinuation 09/Jan/2012 标准包装:50 系列:* 频率:850MHz ~ 2.175GHz 灵敏度:- 数据传输率 - 最大:- 调制或协议:- 应用:* 电流 - 接收:* 数据接口:PCB，表面贴装 存储容量:- 天线连接器:PCB，表面贴装 特点:- 电源电压:4.75 V ~ 5.25 V 工作温度:0°C ~ 85°C 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP（6x6） 包装:托盘
RXM-900-HP3-SPO
功能描述:射频模块 RF Receiver 900MHz 8-CH SMD Pack
RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm
RXM-900-HP3-SPO_
功能描述:RECEIVER RF 900MHZ 8-CH SMD RoHS:是 类别:RF/IF 和 RFID >> RF 接收器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS 产品变化通告:Product Discontinuation 09/Jan/2012 标准包装:50 系列:* 频率:850MHz ~ 2.175GHz 灵敏度:- 数据传输率 - 最大:- 调制或协议:- 应用:* 电流 - 接收:* 数据接口:PCB，表面贴装 存储容量:- 天线连接器:PCB，表面贴装 特点:- 电源电压:4.75 V ~ 5.25 V 工作温度:0°C ~ 85°C 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP（6x6） 包装:托盘
RXM-900-HP3-SPS
功能描述:射频模块 RF Receiver 900MHz 8 & 100-CH SMD Pack
RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm